"Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly ..."

Seokjun Jang et al. (2025)

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DOI: 10.1109/ACCESS.2025.3541678

access: open

type: Journal Article

metadata version: 2025-03-07

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Seokjun Jang, Donghyun Han, Sunghoon Kim, Dayoung Kim, Sungho Kang:
Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults. IEEE Access 13: 30722-30731 (2025)

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