"Antenna-in-Package Using IC-Embedded Metal Fan-Out Wafer-Level Package for ..."

Ju-Yong Lee et al. (2025)

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DOI: 10.1109/ACCESS.2025.3577256

access: open

type: Journal Article

metadata version: 2025-08-09

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Ju-Yong Lee, Jein Yu, Wansik Kim, Jong-Min Yook:
Antenna-in-Package Using IC-Embedded Metal Fan-Out Wafer-Level Package for D-Band Applications. IEEE Access 13: 107736-107744 (2025)

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