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"Epoxy Molding Compound Lead Frames With Silicone Resin for Encapsulating ..."

Tsung-Yen Liu et al. (2021)

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DOI: 10.1109/ACCESS.2021.3111258

access: open

type: Journal Article

metadata version: 2021-11-03

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  - https://dblp.org/rec/journals/access/LiuHLLCSL21
Tsung-Yen Liu, Shih-Ming Huang, Mu-Jen Lai, Rui-Sen Liu, Yi-Tsung Chang, Wen-Hong Sun, Ray-Ming Lin:
Epoxy Molding Compound Lead Frames With Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes. IEEE Access 9: 129874-129880 (2021)

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