"Infrared Thermal Imaging-Based Crack Detection Using Deep Learning."

Jun Yang et al. (2019)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2019.2958264

access: open

type: Journal Article

metadata version: 2023-10-23

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/YangWLLSS19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/YangWLLSS19
Jun Yang, Wei Wang, Guang Lin, Qing Li, Yeqing Sun, Yixuan Sun:
Infrared Thermal Imaging-Based Crack Detection Using Deep Learning. IEEE Access 7: 182060-182077 (2019)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.