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"Thermal parameters optimization of a reflow soldering profile in printed ..."

Tsung-Nan Tsai (2012)

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DOI: 10.1016/J.ASOC.2012.03.066

access: closed

type: Journal Article

metadata version: 2017-06-05

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Tsung-Nan Tsai:
Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study. Appl. Soft Comput. 12(8): 2601-2613 (2012)

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