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"Selection of High Strength Encapsulant for MEMS Devices Undergoing High ..."

Azrul Azlan Hamzah et al. (2008)

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DOI: —

access: open

type: Informal or Other Publication

metadata version: 2018-08-13

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  - electronic edition @ arxiv.org (open access)
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  dblp key:
  - journals/corr/abs-0802-3086
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  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-0802-3086
Azrul Azlan Hamzah, Yusnira Husaini, Burhanuddin Yeop Majlis, Ibrahim Ahmad:
Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging. CoRR abs/0802.3086 (2008)

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