"Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D ..."

Yukai Chen et al. (2025)

> Home

Details and statistics

DOI: 10.48550/ARXIV.2508.02284

access: open

type: Informal or Other Publication

metadata version: 2025-09-10

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/corr/abs-2508-02284
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-2508-02284
Yukai Chen, Massimiliano Di Todaro, Bjorn Vermeersch, Herman Oprins, Daniele Jahier Pagliari, Julien Ryckaert, Dwaipayan Biswas, James Myers:
Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology. CoRR abs/2508.02284 (2025)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.