"On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A ..."

Debendra Das Sharma et al. (2025)

> Home

Details and statistics

DOI: 10.48550/ARXIV.2510.06513

access: open

type: Informal or Other Publication

metadata version: 2025-11-10

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/corr/abs-2510-06513
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-2510-06513
Debendra Das Sharma, Swadesh Choudhary, Peter Z. Onufryk, Rob Pelt:
On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach. CoRR abs/2510.06513 (2025)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.