"Affordable and Comprehensive Testing of 3-D Stacked Die Devices."

Jean-François Côté et al. (2022)

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DOI: 10.1109/MDAT.2022.3191016

access: closed

type: Journal Article

metadata version: 2022-10-18

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  - https://dblp.org/rec/journals/dt/CoteFSDLGYKGRPM22
Jean-François Côté, Jeff Fan, Sean Shen, Givargis Danialy, Marcin Lipinski, Michael Garbers, Wu Yang, Martin Keim, Andreas Glowatz, Joe Reynick, Ayush Patel, Joanna Michna:
Affordable and Comprehensive Testing of 3-D Stacked Die Devices. IEEE Des. Test 39(5): 17-25 (2022)

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