"Integrated Thermal Management in System-on-Package Devices."

György Bognár et al. (2020)

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DOI: 10.3311/PPEE.14986

access: open

type: Journal Article

metadata version: 2023-05-23

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György Bognár, Gábor Takács, Péter G. Szabó, Gábor Rózsás, László Pohl, Balázs Plesz:
Integrated Thermal Management in System-on-Package Devices. Period. Polytech. Electr. Eng. Comput. Sci. 64(2): 200-210 (2020)

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