"A Mini-Review on the Thermal Fatigue Properties of Copper Materials ..."

Yunfei Sun et al. (2023)

> Home

Details and statistics

DOI: 10.3390/E25050714

access: open

type: Journal Article

metadata version: 2023-07-07

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/entropy/SunLLCZXJ23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/entropy/SunLLCZXJ23
Yunfei Sun, Tong Li, Lan Lan, Jiahua Chen, Wanqian Zhu, Song Xue, Limin Jin:
A Mini-Review on the Thermal Fatigue Properties of Copper Materials Applied at the Front-End of Synchrotron Radiation Facilities. Entropy 25(5): 714 (2023)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.