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"A novel approach for wafer defect pattern classification based on ..."

Seungchan Ko, Dowan Koo (2023)

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DOI: 10.1016/J.ESWA.2023.120765

access: closed

type: Journal Article

metadata version: 2023-10-14

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Seungchan Ko, Dowan Koo:
A novel approach for wafer defect pattern classification based on topological data analysis. Expert Syst. Appl. 231: 120765 (2023)

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