"Damascene copper electroplating for chip interconnections."

Panayotis C. Andricacos et al. (1998)

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DOI: 10.1147/RD.425.0567

access: closed

type: Journal Article

metadata version: 2020-03-13

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  - https://dblp.org/rec/journals/ibmrd/AndricacosUDHD98
Panayotis C. Andricacos, Cyprian Uzoh, John O. Dukovic, Jean Horkans, Hariklia Deligianni:
Damascene copper electroplating for chip interconnections. IBM J. Res. Dev. 42(5): 567-574 (1998)

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