"Fabrication and characterization of robust through-silicon vias for ..."

Paul S. Andry et al. (2008)

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DOI: 10.1147/JRD.2008.5388558

access: closed

type: Journal Article

metadata version: 2020-03-13

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Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer:
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. IBM J. Res. Dev. 52(6): 571-581 (2008)

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