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"IBM POWER9 package technology and design."
Sungjun Chun et al. (2018)
- Sungjun Chun, Wiren Dale Becker, Jon Casey, Steve Ostrander, Daniel Dreps, Jose Ale Hejase, Ryan Nett, Brian Beaman, Jason R. Eagle:
IBM POWER9 package technology and design. IBM J. Res. Dev. 62(4/5): 12:1-12:10 (2018)
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