"Electromigration and stress-induced voiding in fine Al and Al-alloy ..."

Chao-Kun Hu et al. (1995)

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DOI: 10.1147/RD.394.0465

access: closed

type: Journal Article

metadata version: 2020-03-13

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Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin:
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM J. Res. Dev. 39(4): 465-498 (1995)

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