"Strain measurement and numerical analysis of an epoxy adhesive subjected ..."

Joseph Kuczynski, Arvind K. Sinha (2001)

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DOI: 10.1147/RD.456.0783

access: closed

type: Journal Article

metadata version: 2020-03-13

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Joseph Kuczynski, Arvind K. Sinha:
Strain measurement and numerical analysis of an epoxy adhesive subjected to thermal loads. IBM J. Res. Dev. 45(6): 783-788 (2001)

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