"Latent defect screening for high-reliability glass-ceramic multichip ..."

Edward J. Yarmchuk, Christopher W. Cline, Dominic C. Bruen (2005)

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DOI: 10.1147/RD.494.0677

access: closed

type: Journal Article

metadata version: 2020-03-13

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Edward J. Yarmchuk, Christopher W. Cline, Dominic C. Bruen:
Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects. IBM J. Res. Dev. 49(4-5): 677-686 (2005)

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