"Transient thermal analysis of packaged SiC SBDs for high temperature ..."

Taehwa Kim, Tsuyoshi Funaki (2016)

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DOI: 10.1587/ELEX.13.20151047

access: open

type: Journal Article

metadata version: 2021-02-12

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Taehwa Kim, Tsuyoshi Funaki:
Transient thermal analysis of packaged SiC SBDs for high temperature operation. IEICE Electron. Express 13(6): 20151047 (2016)

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