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"Analysis of the residual error due to mechanical stress in BJT-based CMOS ..."

Dexin Kong, Fengqi Yu (2017)

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DOI: 10.1587/ELEX.14.20170318

access: open

type: Journal Article

metadata version: 2021-02-12

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  dblp key:
  - journals/ieiceee/KongY17a
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  - https://dblp.org/rec/journals/ieiceee/KongY17a
Dexin Kong, Fengqi Yu:
Analysis of the residual error due to mechanical stress in BJT-based CMOS temperature sensors. IEICE Electron. Express 14(12): 20170318 (2017)

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