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"Bond wires aging monitoring for IGBT module based on junction temperature ..."
Yulin Liu et al. (2023)
- Yulin Liu, Mingxing Du, Jinliang Yin, Chao Dong:
Bond wires aging monitoring for IGBT module based on junction temperature difference of TSEPs. IEICE Electron. Express 20(21): 20230275 (2023)
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