"A novel in-field TSV repair method for latent faults."

Tianming Ni et al. (2018)

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DOI: 10.1587/ELEX.15.20180873

access: open

type: Journal Article

metadata version: 2021-02-12

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  - journals/ieiceee/NiCQH18
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  - https://dblp.org/rec/journals/ieiceee/NiCQH18
Tianming Ni, Hao Chang, Haochen Qi, Zhengfeng Huang:
A novel in-field TSV repair method for latent faults. IEICE Electron. Express 15(23): 20180873 (2018)

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