"Review of wafer-level three-dimensional integration (3DI) using bumpless ..."

Takayuki Ohba et al. (2015)

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DOI: 10.1587/ELEX.12.20152002

access: open

type: Journal Article

metadata version: 2021-02-12

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  - https://dblp.org/rec/journals/ieiceee/OhbaKMMFK15
Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama:
Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. IEICE Electron. Express 12(7): 20152002 (2015)

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