"Temperature properties of the parasitic resistance of through-silicon vias ..."

Yintang Yang et al. (2014)

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DOI: 10.1587/ELEX.11.20140504

access: open

type: Journal Article

metadata version: 2021-02-12

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  - journals/ieiceee/YangLZD14
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  - https://dblp.org/rec/journals/ieiceee/YangLZD14
Yintang Yang, Xiaoxian Liu, Zhangming Zhu, Ruixue Ding:
Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs. IEICE Electron. Express 11(14): 20140504 (2014)

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