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"Modeling and optimization of noise coupling in TSV-based 3D ICs."

Yingbo Zhao, Yintang Yang, Gang Dong (2014)

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DOI: 10.1587/ELEX.11.20140797

access: open

type: Journal Article

metadata version: 2021-02-12

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  dblp key:
  - journals/ieiceee/ZhaoYD14
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  persistent URL:
  - https://dblp.org/rec/journals/ieiceee/ZhaoYD14
Yingbo Zhao, Yintang Yang, Gang Dong:
Modeling and optimization of noise coupling in TSV-based 3D ICs. IEICE Electron. Express 11(20): 20140797 (2014)

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