"Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient ..."

Eiji Higurashi et al. (2017)

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DOI: 10.1587/TRANSELE.E100.C.156

access: closed

type: Journal Article

metadata version: 2020-06-15

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Eiji Higurashi, Ken Okumura, Yutaka Kunimune, Tadatomo Suga, Kei Hagiwara:
Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method. IEICE Trans. Electron. 100-C(2): 156-160 (2017)

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