"High-Frequency and Integrated Design Based on Flip-Chip Interconnection ..."

Shigeru Kanazawa et al. (2019)

> Home

Details and statistics

DOI: 10.1587/TRANSELE.2018ODI0001

access: closed

type: Journal Article

metadata version: 2023-09-30

- view
  authority control:
- export record
  dblp key:
  - journals/ieicet/KanazawaYUKOOST19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ieicet/KanazawaYUKOOST19
Shigeru Kanazawa, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshihiro Ogiso, Johsuke Ozaki, Takahiko Shindo, Satoshi Tsunashima, Hiromasa Tanobe, Atsushi Araratake:
High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices. IEICE Trans. Electron. 102-C(4): 340-346 (2019)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.