"Co-modeling, Experimental Verification, and Analysis of Chip-Package ..."

Hyunjeong Park et al. (2008)

Details and statistics

DOI: 10.1093/IETELE/E91-C.4.595

access: closed

type: Journal Article

metadata version: 2020-04-11

a service of  Schloss Dagstuhl - Leibniz Center for Informatics