"The development of a wire saw for wafer slicing of single-crystal silicon."

Z. J. Hou, P. Q. Ge, Y. F. Gao (2007)

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DOI: 10.1504/IJCAT.2007.015260

access: closed

type: Journal Article

metadata version: 2020-09-17

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Z. J. Hou, P. Q. Ge, Y. F. Gao:
The development of a wire saw for wafer slicing of single-crystal silicon. Int. J. Comput. Appl. Technol. 29(2/3/4): 187-190 (2007)

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