"Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic ..."

Yufeng Jin et al. (2003)

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DOI: 10.1142/S1465876303001216

access: closed

type: Journal Article

metadata version: 2020-07-09

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Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang:
Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. Int. J. Comput. Eng. Sci. 4(2): 335-338 (2003)

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