"Effects Of Wafer Bonding And Thinning Processes On Electrical Performance ..."

Wenjiang Zeng et al. (2003)

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DOI: 10.1142/S1465876303001186

access: closed

type: Journal Article

metadata version: 2020-07-09

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  - https://dblp.org/rec/journals/ijces/ZengLZCHHB03
Wenjiang Zeng, Huamao Lin, Xiaolin Zhang, Ramasamy Chockalingam, Wee Chong Heng, Sangki Hong, Narayanan Balasubramanian:
Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices. Int. J. Comput. Eng. Sci. 4(2): 323-326 (2003)

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