"Application of RFID on equipment parts readiness management system of ..."

Wei-Ling Wang et al. (2013)

> Home

Details and statistics

DOI: 10.1504/IJITM.2013.051630

access: closed

type: Journal Article

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/ijitm/WangHWCL13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ijitm/WangHWCL13
Wei-Ling Wang, Chiao-Tzu Huang, Shu-Jen Wang, Chia-Pao Chang, Hui-Wen Liao:
Application of RFID on equipment parts readiness management system of semiconductor packaging plant. Int. J. Inf. Technol. Manag. 12(1/2): 67-84 (2013)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.