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"Thermomechanical Modeling of Electronic packages."

N. Jagannathan, R. Palaninathan (2011)

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DOI: 10.1142/S1793962311000384

access: closed

type: Journal Article

metadata version: 2020-05-27

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N. Jagannathan, R. Palaninathan:
Thermomechanical Modeling of Electronic packages. Int. J. Model. Simul. Sci. Comput. 2(1) (2011)

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