Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element ..."

Jian (Jessie) Wu et al. (2008)

> Home

Details and statistics

DOI: 10.1504/IJMTM.2008.016769

access: closed

type: Journal Article

metadata version: 2020-06-04

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/ijmtm/WuSPXS08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ijmtm/WuSPXS08
Jian (Jessie) Wu, Xuekun Sun, Z. J. Pei, X. Jack Xin, Kelli Simmelink:
Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments. Int. J. Manuf. Technol. Manag. 13(2/3/4): 169-186 (2008)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.