"Integrated circuit packaging review with an emphasis on 3D packaging."

Austin Lancaster, Manish Keswani (2018)

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DOI: 10.1016/J.VLSI.2017.09.008

access: closed

type: Journal Article

metadata version: 2022-10-02

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Austin Lancaster, Manish Keswani:
Integrated circuit packaging review with an emphasis on 3D packaging. Integr. 60: 204-212 (2018)

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