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"Role of Through Silicon Via in 3D Integration: Impact on Delay and Power."

Shivangi Chandrakar, Deepika Gupta, Manoj Kumar Majumder (2021)

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DOI: 10.1142/S0218126621500511

access: closed

type: Journal Article

metadata version: 2022-12-07

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  dblp key:
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  - https://dblp.org/rec/journals/jcsc/ChandrakarGM21
Shivangi Chandrakar, Deepika Gupta, Manoj Kumar Majumder:
Role of Through Silicon Via in 3D Integration: Impact on Delay and Power. J. Circuits Syst. Comput. 30(3): 2150051:1-2150051:20 (2021)

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