Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Cross-Layer Dual Modular Redundancy Hardened Scheme of Flip-Flop Design ..."

Zhengfeng Huang et al. (2021)

> Home

Details and statistics

DOI: 10.1142/S0218126621200036

access: closed

type: Journal Article

metadata version: 2021-06-09

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/jcsc/HuangSNXQLEX21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/jcsc/HuangSNXQLEX21
Zhengfeng Huang, Zian Su, Tianming Ni, Qi Xu, Haochen Qi, Yingchun Lu, Manzi Eric, Hui Xu:
Cross-Layer Dual Modular Redundancy Hardened Scheme of Flip-Flop Design Based on Sense-Amplifier. J. Circuits Syst. Comput. 30(5): 2120003:1-2120003:16 (2021)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.