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"Prototype model for automatic integrated circuit bonding inspection."

Mandava Rajeswari, K. Saravanan (1995)

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DOI: 10.1117/12.210719

access: closed

type: Journal Article

metadata version: 2017-05-28

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  - journals/jei/RajeswariS95
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  - https://dblp.org/rec/journals/jei/RajeswariS95
Mandava Rajeswari, K. Saravanan:
Prototype model for automatic integrated circuit bonding inspection. J. Electronic Imaging 4(3): 305-313 (1995)

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