"A hybrid intelligent approach for optimizing the fine-pitch copper wire ..."

Tsung-Nan Tsai (2014)

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DOI: 10.1007/S10845-012-0685-Y

access: closed

type: Journal Article

metadata version: 2020-09-24

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Tsung-Nan Tsai:
A hybrid intelligent approach for optimizing the fine-pitch copper wire bonding process with multiple quality characteristics in IC assembly. J. Intell. Manuf. 25(1): 177-192 (2014)

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