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"Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic ..."

Florian Thoma et al. (2014)

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DOI: 10.3390/MI5030783

access: open

type: Journal Article

metadata version: 2024-06-18

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  dblp key:
  - journals/micromachines/ThomaGCW14
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  - https://dblp.org/rec/journals/micromachines/ThomaGCW14
Florian Thoma, Frank Goldschmidtböing, Keith Cobry, Peter Woias:
Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems. Micromachines 5(3): 783-796 (2014)

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