"In-situ characterization up to 100 GHz of insulators used in new 3D ..."

Gregory Houzet et al. (2021)

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DOI: 10.1016/J.MEJO.2021.104990

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type: Journal Article

metadata version: 2021-10-14

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Gregory Houzet, Thierry Lacrevaz, Cédric Bermond, Philippe Artillan, David Auchère, Laurent Schwarz, Bernard Fléchet:
In-situ characterization up to 100 GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies. Microelectron. J. 108: 104990 (2021)

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