"Simulation and reliability testing of leadless package high-temperature ..."

Zhong Jin et al. (2022)

> Home

Details and statistics

DOI: 10.1016/J.MEJO.2022.105568

access: closed

type: Journal Article

metadata version: 2022-12-09

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mj/JinTTL22
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mj/JinTTL22
Zhong Jin, Junwang Tian, Xin Tang, Junhui Li:
Simulation and reliability testing of leadless package high-temperature pressure sensor. Microelectron. J. 129: 105568 (2022)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.