"Frequency response and transient analysis of through glass packaging vias ..."

Ajay Kumar, Rohit Dhiman (2023)

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DOI: 10.1016/J.MEJO.2023.105941

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type: Journal Article

metadata version: 2023-11-28

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Ajay Kumar, Rohit Dhiman:
Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs. Microelectron. J. 141: 105941 (2023)

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