"Thermal optimization of dual-sided embedded liquid cooling for ..."

Yunting Liu et al. (2025)

> Home

Details and statistics

DOI: 10.1016/J.MEJO.2025.106714

access: closed

type: Journal Article

metadata version: 2025-05-23

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mj/LiuFSLCL25
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mj/LiuFSLCL25
Yunting Liu, Rong Fu, Meiying Su, Jun Li, Chuan Chen, Fengman Liu:
Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures. Microelectron. J. 161: 106714 (2025)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.