"Numerical simulation of copper electrodeposition for Through Silicon Via ..."

Yanan Tao et al. (2024)

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DOI: 10.1016/J.MEJO.2024.106089

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type: Journal Article

metadata version: 2024-02-29

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Yanan Tao, Chao Liang, Ziqi Mei, Zhiqiang Song, Yu Wu, Yunna Sun, Wenqiang Zhang, Yong Ruan, Xiaoguang Zhao:
Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system. Microelectron. J. 144: 106089 (2024)

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