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"Influence of transient flow and solder bump resistance on underfill process."
J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom (2005)
- J. W. Wan, Wen-Jun Zhang
, D. J. Bergstrom:
Influence of transient flow and solder bump resistance on underfill process. Microelectron. J. 36(8): 687-693 (2005)
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