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"Improved compact thermal model for studying 3-D interconnect structures ..."

A. Whelan, Y. Joshi, W. King (2008)

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DOI: 10.1016/J.MEJO.2007.06.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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A. Whelan, Y. Joshi, W. King:
Improved compact thermal model for studying 3-D interconnect structures with low-k dielectrics. Microelectron. J. 39(7): 1016-1022 (2008)

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