"Vibrational fatigue and reliability of package-on-package stacked chip ..."

Bing Yang et al. (2019)

> Home

Details and statistics

DOI: 10.1016/J.MEJO.2019.104609

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mj/YangLYHY19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mj/YangLYHY19
Bing Yang, Dongbo Li, Haiying Yang, Yongle Hu, Ping Yang:
Vibrational fatigue and reliability of package-on-package stacked chip assembly. Microelectron. J. 92 (2019)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.