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"A study of through package vias in a glass interposer for multifunctional ..."

Abderrahim El Amrani et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.108

access: closed

type: Journal Article

metadata version: 2023-09-30

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Abderrahim El Amrani, Abdellah Benali, Mohsine Bouya, Mustapha Faqir, K. Demir, Abdelkader Hadjoudja, Mounir Ghogho:
A study of through package vias in a glass interposer for multifunctional and miniaturized systems. Microelectron. Reliab. 54(9-10): 1972-1976 (2014)

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