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"Single-joint shear strength of micro Cu pillar solder bumps with different ..."

Y. J. Chen et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.06.116

access: closed

type: Journal Article

metadata version: 2020-02-22

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Y. J. Chen, C. K. Chung, C. R. Yang, C. Robert Kao:
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics. Microelectron. Reliab. 53(1): 47-52 (2013)

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